+86-13723477211
取消

SM671PAC-BFST

Part number SM671PAC-BFST
Product classification Memory
Manufacturer Silicon Motion
Description IC FLASH 512GBIT UFS3.1 153BGA
Encapsulation
Packing Bulk
Quantity 0
RoHS status YES
Share
Inventory:
Total number

Quantity

Price

Total price

1

$33.8100

$33.8100

Obtain quotation information
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrSilicon Motion
SeriesFerri-UFS ™
PackageBulk
Product StatusACTIVE
Package / Case153-TBGA
Mounting TypeSurface Mount
Memory Size512Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C
TechnologyFLASH - NAND (TLC)
Memory FormatFLASH
Supplier Device Package153-BGA (11.5x13)
Memory InterfaceUFS3.1
Memory Organization64G x 8
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
关闭
Inquiry
captcha

+86-13723477211
0