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RP605Z363B-E2-F

Part number RP605Z363B-E2-F
Product classification Power Management - Specialized
Manufacturer RICOH/Nisshinbo Micro Devices
Description 300MA ULTRA-LOW POWER BUCK BOOST
Encapsulation
Packing Tape & Reel (TR)
Quantity 4250
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$2.5305

$2.5305

10

$2.2785

$22.7850

25

$2.1525

$53.8125

100

$1.8270

$182.7000

250

$1.7220

$430.5000

500

$1.5015

$750.7500

1000

$1.2495

$1,249.5000

2500

$1.1550

$2,887.5000

5000

$1.1130

$5,565.0000

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Product parameters
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TYPEDESCRIPTION
MfrRICOH/Nisshinbo Micro Devices
SeriesRP605x
PackageTape & Reel (TR)
Product StatusACTIVE
Package / Case20-XFBGA, WLCSP
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 85°C (TA)
Voltage - Supply1.8V ~ 5.5V
ApplicationsBattery Management, Power Supplies
Current - Supply300nA
Supplier Device Package20-WLCSP-P3 (2.32x1.71)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
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