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MFS2323BMBA0EP

Part number MFS2323BMBA0EP
Product classification Power Management - Specialized
Manufacturer NXP Semiconductors
Description IC
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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Total price

260

$4.5780

$1,190.2800

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Product parameters
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TYPEDESCRIPTION
MfrNXP Semiconductors
Series-
PackageTray
Product StatusACTIVE
Package / Case48-VFQFN Exposed Pad
Mounting TypeSurface Mount, Wettable Flank
Supplier Device Package48-HVQFN (7x7)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
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