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HC9P5502B-9

Part number HC9P5502B-9
Product classification Telecom
Manufacturer Harris Corporation
Description EIA/ITU PABX SLIC
Encapsulation
Packing Bulk
Quantity 29750
RoHS status NO
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Price

Total price

87

$3.6435

$316.9845

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Product parameters
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TYPEDESCRIPTION
MfrHarris Corporation
Series-
PackageBulk
Product StatusOBSOLETE
Package / Case24-SOIC (0.295", 7.50mm Width)
Mounting TypeSurface Mount
FunctionSubscriber Line Interface Concept (SLIC)
Interface2-Wire, 4-Wire
Operating Temperature-40°C ~ 85°C
Voltage - Supply-42V ~ -58V, 4.75V ~ 5.25V, 10.8V ~ 13.2V
Supplier Device Package24-SOIC
Number of Circuits1
Power (Watts)690 mW

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MEMS OSC XO 133.0000MHZ CMOS SMD
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MEMS OSC XO 24.5760MHZ CMOS SMD
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MEMS OSC XO 100.0000MHZ LVPECL
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MEMS OSC XO 125.0000MHZ LVPECL
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MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
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MEMS OSC XO 175.0000MHZ LVDS SMD
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MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
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