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AGID019R18A1I1VB

Part number AGID019R18A1I1VB
Product classification System On Chip (SoC)
Manufacturer Intel
Description IC FPGA AGILEX-I 1805BGA
Encapsulation
Packing Tray
Quantity 0
RoHS status NO
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$38,097.3495

$114,292.0485

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Product parameters
TYPEDESCRIPTION
MfrIntel
SeriesAgilex I
PackageTray
Product StatusACTIVE
Package / Case1805-BBGA Exposed Pad
Speed1.4GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Primary AttributesFPGA - 1.9M Logic Elements
ConnectivityEBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package1805-BGA (42.5x42.5)
ArchitectureMPU, FPGA
Alternative models
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Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
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MEMS OSC XO 100.0000MHZ LVPECL
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MEMS OSC XO 125.0000MHZ LVPECL
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MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
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