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8ULP_SOM_2R16E_I

Part number 8ULP_SOM_2R16E_I
Product classification Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Boundary Devices
Description I.MX8ULP SOM / 2GB / 16GB EMMC /
Encapsulation
Packing Tray
Quantity 19
RoHS status NO
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Quantity

Price

Total price

1

$100.6320

$100.6320

100

$100.6320

$10,063.2000

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Product parameters
TYPEDESCRIPTION
MfrBoundary Devices
Seriesi.MX
PackageTray
Product StatusACTIVE
Size / Dimension2.008" L x 1.260" W (51.00mm x 32.00mm)
Speed216MHz, 1GHz
RAM Size2GB
Operating Temperature-40°C ~ 85°C
Module/Board TypeMPU
Core ProcessorARM® Cortex®-A35, ARM® Cortex®-M33
Flash Size16GB eMMC

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
Roving Networks (Microchip Technology)
MEMS OSC XO 32.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
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