TYPE | DESCRIPTION |
ECCN (US) | EAR99 |
Module | DRAM Module |
Module Density | 8Gbyte |
Number of Chip per Module | 9 |
Chip Density (bit) | 8G |
Data Bus Width (bit) | 72 |
Maximum Clock Rate (MHz) | 2400 |
Chip Configuration | 1Gx8 |
Chip Package Type | FBGA |
Typical Operating Supply Voltage (V) | 1.2 |
Operating Current (mA) | 1305 |
Minimum Operating Temperature (°C) | 0 |
Maximum Operating Temperature (°C) | 85 |
ECC Support | Yes |
Number of Ranks | Single |
CAS Latency | 17 |
Supplier Package | SODIMM |
Mounting | Socket |
Package Height | 30 |
Package Length | 69.6 |
Package Width | 3.7(Max) |
PCB changed | 260 |
Part Status | Obsolete |
Pin Count | 260 |
Organization | 1Gx72 |
Module Type | 260SODIMM |
RoHS Status | Yes with exemptions |
Orignal genuine | Each chip comes from the original factory |
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Main products | Only make original stock |
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Spot inventory | Only make original stock |
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Original stock | Bom Distributio | Affordable Price |