+86-13723477211
  • image of 热垫>A17682-014
  • image of 热垫>A17682-014
A17682-014
A17682-014 datasheet pdf and Thermal - Pads, Sheets product details from Laird Technologies - Thermal Materials stock available at Utmel
A17682-014
热垫
Laird Technologies - Thermal Materials
A17682-014 data
-
-
YES
image of 热垫>A17682-014
image of 热垫>A17682-014
A17682-014
热垫
Laird Technologies - Thermal Materials
A17682-014 data
-
-
NO
TYPEDESCRIPTION
Factory Lead Time 4 Weeks
Material Silicone, Ceramic Filled
Shape Square
Series Tflex™ UT20000
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Type Gap Filler Pad, Sheet
Color Gray
Outline 228.60mm x 228.60mm
Thermal Conductivity 3.0W/m-K
Thickness 0.0140 0.356mm
RoHS Status RoHS Compliant
1.jpg
 原装正品       每颗芯片都来自原厂


2.jpg
       

 主要产品       只生厂材料


3.jpg
        

 现货库存       只生产原材料

4.jpg       

原装库存Bom 单价格实惠


captcha

+86-13723477211

sales@fuchaoic.com

点击这里给我发消息
0