| TYPE | DESCRIPTION |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 35-XFBGA, WLCSP |
| Number of Pins | 35 |
| Operating Temperature | -30°C~85°C TA |
| Packaging | Tape & Reel (TR) |
| Published | 2010 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 35 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Applications | Image Stabilization |
| Additional Feature | IT ALSO OPERATES AT 3V |
| Technology | CMOS |
| Voltage - Supply | 2.6V~3.6V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 3V |
| Terminal Pitch | 0.4mm |
| Function | Driver - Fully Integrated, Control and Power Stage |
| Interface | Parallel |
| Output Configuration | Half Bridge (6) |
| Logic Function | AND |
| Voltage - Load | 2.7V~3.6V |
| Supply Voltage1-Nom | 2.8V |
| Motor Type - AC, DC | Brushed DC |
| Length | 3.39mm |
| Height Seated (Max) | 0.45mm |
| Width | 2.3mm |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
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| 原装正品 | 每颗芯片都来自原厂 |
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| 主要产品 | 只生厂材料 |
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| 现货库存 | 只生产原材料 |
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| 原装库存 | Bom 单 | 价格实惠 |
