TYPE | DESCRIPTION |
Factory Lead Time | 7 Weeks |
Contact Plating | Lead, Tin |
Mount | Surface Mount |
Package / Case | BGA |
Number of Pins | 144 |
Packaging | Bulk |
Published | 2009 |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 144 |
ECCN Code | EAR99 |
Terminal Finish | Tin/Lead (Sn63Pb37) |
Max Operating Temperature | 70°C |
Min Operating Temperature | 0°C |
HTS Code | 8542.32.00.71 |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 225 |
Number of Functions | 1 |
Supply Voltage | 2.5V |
Terminal Pitch | 1mm |
Time@Peak Reflow Temperature-Max (s) | 20 |
Pin Count | 144 |
Qualification Status | Not Qualified |
Operating Supply Voltage | 2.5V |
Temperature Grade | COMMERCIAL |
Max Supply Voltage | 2.625V |
Min Supply Voltage | 2.375V |
Element Configuration | Dual |
Nominal Supply Current | 60mA |
Max Supply Current | 60mA |
Clock Frequency | 83MHz |
Frequency (Max) | 200MHz |
Access Time | 3.6 ns |
Organization | 4KX18 |
Density | 72 kb |
Standby Current-Max | 0.05A |
Parallel/Serial | PARALLEL |
Sync/Async | Asynchronous |
Memory IC Type | OTHER FIFO |
Bus Directional | Unidirectional |
Retransmit Capability | Yes |
Output Enable | YES |
Cycle Time | 5 ns |
Length | 13mm |
Height Seated (Max) | 1.97mm |
Width | 13mm |
Thickness | 1.76mm |
RoHS Status | RoHS Compliant |
Lead Free | Contains Lead |
原装正品 | 每颗芯片都来自原厂 |
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主要产品 | 只生厂材料 |
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现货库存 | 只生产原材料 |
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原装库存 | Bom 单 | 价格实惠 |