TYPE | DESCRIPTION |
Factory Lead Time | 11 Weeks |
Package / Case | 900-BBGA, FCBGA |
Surface Mount | YES |
Operating Temperature | -40°C~100°C TJ |
Packaging | Bulk |
Series | Zynq® UltraScale+™ MPSoC CG |
Published | 2016 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Number of Terminations | 900 |
Additional Feature | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY |
HTS Code | 8542.31.00.01 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Supply Voltage | 0.72V |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PBGA-B900 |
Supply Voltage-Max (Vsup) | 0.742V |
Supply Voltage-Min (Vsup) | 0.698V |
Number of I/O | 204 |
Speed | 500MHz, 1.2GHz |
RAM Size | 256KB |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Peripherals | DMA, WDT |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture | MCU, FPGA |
Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
RoHS Status | ROHS3 Compliant |
原装正品 | 每颗芯片都来自原厂 |
| |
主要产品 | 只生厂材料 |
| |
现货库存 | 只生产原材料 |
|
原装库存 | Bom 单 | 价格实惠 |