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  • image of SoC>XCZU6CG-1FFVB1156I
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XCZU6CG-1FFVB1156I
-40°C~100°C TJ System On Chip Zynq® UltraScale+™ MPSoC CG Series 328 I/O
XCZU6CG-1FFVB1156I
SoC
Xilinx Inc.
-40°C~100°C
-
1156-BBGA, FCBGA
YES
image of SoC>XCZU6CG-1FFVB1156I
image of SoC>XCZU6CG-1FFVB1156I
XCZU6CG-1FFVB1156I
SoC
Xilinx Inc.
-40°C~100°C
-
1156-BBGA, FCBGA
NO
TYPEDESCRIPTION
Factory Lead Time 11 Weeks
Package / Case 1156-BBGA, FCBGA
Operating Temperature -40°C~100°C TJ
Packaging Bulk
Series Zynq® UltraScale+™ MPSoC CG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of I/O 328
Speed 500MHz, 1.2GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 469K+ Logic Cells
RoHS Status ROHS3 Compliant
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 原装正品       每颗芯片都来自原厂


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 主要产品       只生厂材料


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 现货库存       只生产原材料

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原装库存Bom 单价格实惠


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