TYPE | DESCRIPTION |
Factory Lead Time | 10 Weeks |
Contact Plating | Copper, Silver, Tin |
Mount | Surface Mount |
Package / Case | 900-BBGA, FCBGA |
Number of Pins | 900 |
Operating Temperature | -40°C~100°C TJ |
Packaging | Tray |
Series | Zynq®-7000 |
Published | 2010 |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Number of Terminations | 900 |
ECCN Code | 3A991.D |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
Additional Feature | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY |
HTS Code | 8542.39.00.01 |
Technology | CMOS |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 245 |
Supply Voltage | 1V |
Terminal Pitch | 1mm |
Frequency | 800MHz |
Time@Peak Reflow Temperature-Max (s) | 30 |
Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Max Supply Voltage | 1.05V |
Min Supply Voltage | 950mV |
Number of I/O | 130 |
RAM Size | 256KB |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals | DMA |
Propagation Delay | 120 ps |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Turn On Delay Time | 120 ps |
Architecture | MCU, FPGA |
Core Architecture | ARM |
Boundary Scan | YES |
RAM (words) | 256000 |
Primary Attributes | Kintex™-7 FPGA, 444K Logic Cells |
Number of Registers | 554800 |
Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
Length | 31mm |
Height Seated (Max) | 3.35mm |
Width | 31mm |
RoHS Status | ROHS3 Compliant |
原装正品 | 每颗芯片都来自原厂 |
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主要产品 | 只生厂材料 |
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现货库存 | 只生产原材料 |
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原装库存 | Bom 单 | 价格实惠 |