| TYPE | DESCRIPTION |
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Package / Case | 676-BBGA, FCBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Zynq®-7000 |
| Published | 2009 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Other uPs/uCs/Peripheral ICs |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 245 |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Frequency | 667MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | XC7Z045 |
| Pin Count | 676 |
| JESD-30 Code | S-PBGA-B676 |
| Operating Supply Voltage | 1V |
| Supply Voltage-Max (Vsup) | 1.05V |
| Power Supplies | 11.8V |
| Interface | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
| Number of I/O | 130 |
| RAM Size | 256KB |
| Memory Type | ROMless |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Data Bus Width | 32b |
| Core Architecture | ARM |
| Boundary Scan | YES |
| Speed Grade | -1 |
| RAM (words) | 256000 |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| Bus Compatibility | CAN; ETHERNET; I2C; SPI; UART; USB |
| UV Erasable | N |
| Length | 27mm |
| Height Seated (Max) | 3.37mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
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| 原装正品 | 每颗芯片都来自原厂 |
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| 主要产品 | 只生厂材料 |
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| 现货库存 | 只生产原材料 |
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| 原装库存 | Bom 单 | 价格实惠 |
