| TYPE | DESCRIPTION |
| Factory Lead Time | 12 Weeks |
| Surface Mount | YES |
| Operating Temperature | -40°C~85°C |
| Series | OSD335x |
| Size / Dimension | 0.83 x 0.83 21mmx21mm |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 256 |
| Connector Type | 256-BGA |
| Additional Feature | GPMC OF 28 BIT-ADDRESS LINES AND 16 BIT-DATA LINES AVAILABLE |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Terminal Pitch | 1.27mm |
| JESD-30 Code | S-PBGA-B256 |
| Speed | 1GHz |
| RAM Size | 512MB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
| Core Processor | ARM® Cortex®-A8, AM3358 |
| Boundary Scan | YES |
| Module/Board Type | MPU Core |
| Co-Processor | NEON™ SIMD |
| Length | 21mm |
| Height Seated (Max) | 3.08mm |
| Width | 21mm |
| RoHS Status | ROHS3 Compliant |
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| 原装正品 | 每颗芯片都来自原厂 |
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| 主要产品 | 只生厂材料 |
| |
| 现货库存 | 只生产原材料 |
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| 原装库存 | Bom 单 | 价格实惠 |
