| TYPE | DESCRIPTION |
| Lifecycle Status | PRODUCTION (Last Updated: 1 month ago) |
| Factory Lead Time | 12 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 208-FBGA, CSPBGA |
| Number of Pins | 208 |
| Operating Temperature | 0°C~70°C TA |
| Packaging | Tray |
| Series | Blackfin® |
| JESD-609 Code | e1 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 208 |
| Type | Fixed Point |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage | 1.8V |
| Terminal Pitch | 0.8mm |
| Frequency | 600MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | ADSP-BF523 |
| Pin Count | 208 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 3.3V |
| Interface | DMA, I2C, PPI, SPI, SPORT, UART |
| Max Supply Voltage | 3.6V |
| Min Supply Voltage | 1.7V |
| Memory Size | 132kB |
| RAM Size | 32kB |
| Bit Size | 32 |
| Data Bus Width | 16b |
| Number of Timers/Counters | 9 |
| Address Bus Width | 19 |
| Core Architecture | Blackfin |
| Boundary Scan | YES |
| Low Power Mode | YES |
| Voltage - I/O | 1.8V 2.5V 3.3V |
| Number of UART Channels | 2 |
| Barrel Shifter | YES |
| Internal Bus Architecture | MULTIPLE |
| Non-Volatile Memory | ROM (32kB) |
| Voltage - Core | 1.10V |
| Length | 17mm |
| Height Seated (Max) | 1.75mm |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |
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| 原装正品 | 每颗芯片都来自原厂 |
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| 主要产品 | 只生厂材料 |
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| 现货库存 | 只生产原材料 |
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| 原装库存 | Bom 单 | 价格实惠 |
