TYPE | DESCRIPTION |
Mounting Type | Surface Mount |
Package / Case | 19-UFBGA, WLCSP |
Surface Mount | YES |
Operating Temperature | -40°C~85°C |
Packaging | Tape & Reel (TR) |
Published | 2017 |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 19 |
HTS Code | 8542.39.00.01 |
Voltage - Supply | 2.3V~3.6V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Supply Voltage | 3.3V |
Terminal Pitch | 0.4mm |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | SX865 |
JESD-30 Code | R-PBGA-B19 |
Interface | I2C, Serial |
Current - Supply | 120μA |
Telecom IC Type | TELECOM CIRCUIT |
Resolution (Bits) | 12 b |
Touchscreen | 4 or 5 Wire Resistive |
Voltage Reference | Internal |
Length | 2.07mm |
Height Seated (Max) | 0.604mm |
Width | 2.07mm |
RoHS Status | RoHS Compliant |
原装正品 | 每颗芯片都来自原厂 |
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主要产品 | 只生厂材料 |
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现货库存 | 只生产原材料 |
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原装库存 | Bom 单 | 价格实惠 |