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  • image of RFI和EMI触点>BMI-C-007-01
  • image of RFI和EMI触点>BMI-C-007-01
BMI-C-007-01
Shield Finger 0.059 1.50mm 0.130 3.30mm 0.126 3.20mm BMI-C Beryllium Copper Tin
BMI-C-007-01
RFI和EMI触点
Laird Technologies EMI
Shield Finger 0
-
-
YES
: 0.711582

1

0.711582

0.711582

10

0.671304

6.71304

100

0.633305

63.3305

500

0.597458

298.729

1000

0.56364

563.64

image of RFI和EMI触点>BMI-C-007-01
image of RFI和EMI触点>BMI-C-007-01
BMI-C-007-01
RFI和EMI触点
Laird Technologies EMI
Shield Finger 0
-
-
NO
TYPEDESCRIPTION
Factory Lead Time 5 Weeks
Material Beryllium Copper
Packaging Tape & Reel (TR)
Series BMI-C
Published 2008
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Shield Finger
Plating Tin
Attachment Method Solder
Height 0.126 3.20mm
Length 0.130 3.30mm
Width 0.059 1.50mm
RoHS Status RoHS Compliant
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 原装正品       每颗芯片都来自原厂


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 主要产品       只生厂材料


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 现货库存       只生产原材料

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原装库存Bom 单价格实惠


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