| TYPE | DESCRIPTION |
| Lifecycle Status | PRODUCTION (Last Updated: 3 weeks ago) |
| Factory Lead Time | 10 Weeks |
| Contact Plating | Copper, Silver, Tin |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 8-UFBGA, WLCSP |
| Number of Pins | 8 |
| Packaging | Tape & Reel (TR) |
| JESD-609 Code | e1 |
| Pbfree Code | no |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 8 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Voltage - Supply | 2.5V~3.3V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 260 |
| Number of Functions | 1 |
| Supply Voltage | 3V |
| Terminal Pitch | 0.5mm |
| Frequency | 450MHz~6GHz |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Base Part Number | ADL5502 |
| Pin Count | 8 |
| Qualification Status | Not Qualified |
| Temperature Grade | INDUSTRIAL |
| Operating Supply Current | 3mA |
| Nominal Supply Current | 3mA |
| Accuracy | ±0.25dB |
| Response Time | 15 μs |
| Telecom IC Type | RF AND BASEBAND CIRCUIT |
| RF Type | Cellular, CDMA2000, OFDM, W-CDMA |
| Input Range | -15dBm ~ 12dBm |
| Length | 1.46mm |
| Height Seated (Max) | 0.625mm |
| Width | 1.46mm |
| REACH SVHC | No SVHC |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Contains Lead |
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| 原装正品 | 每颗芯片都来自原厂 |
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| 主要产品 | 只生厂材料 |
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| 现货库存 | 只生产原材料 |
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| 原装库存 | Bom 单 | 价格实惠 |
