1
0.161
0.161
10
0.151887
1.51887
100
0.143289
14.3289
500
0.135179
67.5895
1000
0.127527
127.527
TYPE | DESCRIPTION |
Factory Lead Time | 5 Weeks |
Contact Material | Brass Alloy |
Mount | PCB |
Mounting Type | Through Hole |
Material | Brass |
Mounting Hole Diameter | 0.064 (1.63mm) |
Series | 2308 |
Published | 2011 |
Packaging | Bulk |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Swage |
ECCN Code | EAR99 |
Connector Type | Solder |
Gender | Male |
HTS Code | 8536.90.40.00 |
Contact Finish | Tin |
Insulation | Non-Insulated |
Terminal Type | Single End |
Hole Diameter | 1.63 mm |
Flange Diameter | 0.094 (2.39mm) |
Outside Diameter | 2.39 mm |
Number of Turrets | Double |
Staking Side OD | 0.061 (1.55mm) |
Staking Side ID | 0.044 (1.12mm) |
Length | 6.09mm |
Contact Finish Thickness | 200.0μin 5.08μm |
Length - Overall | 6.090 154.69mm |
Board Thickness | 0.062 1.57mm |
Length - Below Flange | 0.090 2.29mm |
Length - Above Board | 0.084 2.13mm |
Diameter - Turret Head | 0.061 (1.55mm) |
RoHS Status | ROHS3 Compliant |
原装正品 | 每颗芯片都来自原厂 |
| |
主要产品 | 只生厂材料 |
| |
现货库存 | 只生产原材料 |
|
原装库存 | Bom 单 | 价格实惠 |