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  • image of 矩形连接器阵列>SEAM8-50-S02.0-L-04-3
  • image of 矩形连接器阵列>SEAM8-50-S02.0-L-04-3
SEAM8-50-S02.0-L-04-3
High Density Array, Male Reel 4 Row Rows 0.8 mm Surface Mount 200 Position Positions SEAM8 Gold Copper Alloy
SEAM8-50-S02.0-L-04-3
矩形连接器阵列
Samtec, Inc.
High Density Ar
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-
YES
image of 矩形连接器阵列>SEAM8-50-S02.0-L-04-3
image of 矩形连接器阵列>SEAM8-50-S02.0-L-04-3
SEAM8-50-S02.0-L-04-3
矩形连接器阵列
Samtec, Inc.
High Density Ar
-
-
NO
TYPEDESCRIPTION
Contact Plating Gold
Contact Material Copper Alloy
Mounting Type Surface Mount
Housing Material Liquid Crystal Polymer (LCP)
Mounting Style PCB Mount
RoHS Details
Maximum Data Rate 28 Gbps, 56 Gbps
Tradename SEARAY
Package Strip
Base Product Number SEAM8-50
Mated Stacking Heights 7mm
Mfr Samtec Inc.
Product Status Active
Series SEAM8
Packaging Reel
Connector Type High Density Array, Male
Number of Positions 200 Position
Number of Rows 4 Row
Pitch 0.8 mm
Current Rating 1.3 A
Contact Finish Gold
Termination Style Solder
Data Rate 28 Gbps, 56 Gbps
Product Plugs
Mounting Angle Straight
Features Board Guide
Contact Finish Thickness 100.0µin (2.54µm)
Height Above Board 0.179 (4.55mm)
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