| TYPE | DESCRIPTION |
| Factory Lead Time | 17 Weeks |
| Contact Material | Beryllium Copper |
| Mount | Standard |
| Packaging | Bulk |
| Series | Amp-Leaf |
| Published | 1997 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Contact Finish | Gold |
| ELV | Compliant |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Radiation Hardening | No |
| RoHS Status | RoHS Compliant |
| Lead Free | Not Applicable |
 | |
| 原装正品 | 每颗芯片都来自原厂 |
| |
| 主要产品 | 只生厂材料 |
| |
| 现货库存 | 只生产原材料 |
| |
| 原装库存 | Bom 单 | 价格实惠 |
