+86-13723477211
  • image of 模板焊接>PA0169-S
  • image of 模板焊接>PA0169-S
PA0169-S
PA0169-S datasheet pdf and Solder Stencils, Templates product details from Chip Quik Inc. stock available at Utmel
PA0169-S
模板焊接
Chip Quik Inc.
PA0169-S datash
-
-
YES
image of 模板焊接>PA0169-S
image of 模板焊接>PA0169-S
PA0169-S
模板焊接
Chip Quik Inc.
PA0169-S datash
-
-
NO
TYPEDESCRIPTION
Material Stainless Steel
Series Proto-Advantage PA
Published 2009
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Mini SOIC
Number of Positions 10
Pitch 0.020 0.50mm
Outer Dimension 1.300 L x 0.900 W (33.02mm x 22.86mm)
Thickness 0.0040 0.102mm
Diameter - Inner 0.118 L x 0.118 W (3.00mm x 3.00mm)
RoHS Status ROHS3 Compliant
1.jpg
 原装正品       每颗芯片都来自原厂


2.jpg
       

 主要产品       只生厂材料


3.jpg
        

 现货库存       只生产原材料

4.jpg       

原装库存Bom 单价格实惠


captcha

+86-13723477211

sales@fuchaoic.com

点击这里给我发消息
0