TYPE | DESCRIPTION |
Factory Lead Time | 3 Weeks |
Packaging | Jar |
Series | SMD2 |
Published | 2017 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Solder Sphere |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Shelf Life | 24 Months |
Shelf Life Start | Date of Manufacture |
Process | Lead Free |
Melting Point | 423°F~428°F 217°C~220°C |
Diameter | 0.025 0.64mm |
RoHS Status | ROHS3 Compliant |
原装正品 | 每颗芯片都来自原厂 |
| |
主要产品 | 只生厂材料 |
| |
现货库存 | 只生产原材料 |
|
原装库存 | Bom 单 | 价格实惠 |