TYPE | DESCRIPTION |
Factory Lead Time | 3 Weeks |
Series | HF212 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Type | Solder Paste |
Composition | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 |
Shelf Life | 6 Months |
Shelf Life Start | Date of Manufacture |
Form | Jar, 21.16 oz (600g) |
Process | Lead Free |
Melting Point | 411°F~424°F 209°C~218°C |
Flux Type | No-Clean |
RoHS Status | RoHS Compliant |
原装正品 | 每颗芯片都来自原厂 |
| |
主要产品 | 只生厂材料 |
| |
现货库存 | 只生产原材料 |
|
原装库存 | Bom 单 | 价格实惠 |