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  • image of 非焊接面包板>PA0006C
  • image of 非焊接面包板>PA0006C
PA0006C
PA0006C datasheet pdf and Solderless Breadboards product details from Chip Quik, Inc. stock available at Utmel
PA0006C
非焊接面包板
Chip Quik, Inc.
PA0006C datashe
-
-
YES
: 6.334

1

6.334

6.334

10

5.975472

59.75472

100

5.637237

563.7237

500

5.318149

2659.0745

1000

5.017121

5017.121

image of 非焊接面包板>PA0006C
image of 非焊接面包板>PA0006C
PA0006C
非焊接面包板
Chip Quik, Inc.
PA0006C datashe
-
-
NO
TYPEDESCRIPTION
Contact Material Gold
Material FR4 Epoxy Glass
Package Accepted SOIC
RoHS Details
Package Bulk
Base Product Number PA0006
Mfr Chip Quik Inc.
Product Status Active
Series Proto-Advantage
Size / Dimension 0.800 L x 0.700 W (20.32mm x 17.78mm)
Type SOIC-16 to DIP-16 SMT Adapter
Number of Positions 16
Pitch 0.050 (1.27mm)
Proto Board Type SMD to DIP
Product Surface Mount Adapter
Length 20.32 mm
Width 17.78 mm
Height 1.6 mm
Board Thickness 0.063 (1.60mm)
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 原装正品       每颗芯片都来自原厂


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 主要产品       只生厂材料


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 现货库存       只生产原材料

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原装库存Bom 单价格实惠


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