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  • image of 非焊接面包板>IPC0060C
  • image of 非焊接面包板>IPC0060C
IPC0060C
IPC0060C datasheet pdf and Solderless Breadboards product details from Chip Quik, Inc. stock available at Utmel
IPC0060C
非焊接面包板
Chip Quik, Inc.
IPC0060C datash
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YES
image of 非焊接面包板>IPC0060C
image of 非焊接面包板>IPC0060C
IPC0060C
非焊接面包板
Chip Quik, Inc.
IPC0060C datash
-
-
NO
TYPEDESCRIPTION
Contact Material Gold
Material FR4 Epoxy Glass
Package Accepted DFN
RoHS Details
Package Bulk
Mfr Chip Quik Inc.
Product Status Active
Series Proto-Advantage
Size / Dimension 0.400 L x 0.400 W (10.16mm x 10.16mm)
Type DFN-8 to DIP-8 SMT Adapter
Number of Positions 8
Pitch 0.020 (0.50mm)
Proto Board Type SMD to DIP
Product Surface Mount Adapter
Length 10.16 mm
Width 10.16 mm
Height 1.6 mm
Board Thickness 0.063 (1.60mm)
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 原装正品       每颗芯片都来自原厂


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 主要产品       只生厂材料


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 现货库存       只生产原材料

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原装库存Bom 单价格实惠


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